Title :
An Ethernet interface solution of space science experiment payloads
Author :
Tianxiang Jia ; Wenbo Dong
Author_Institution :
Nat. Space Sci. Center, Beijing, China
Abstract :
In order to dynamicly monitor and manage the working state of space science experiment payloads, the large volume of science data should be performed for real-time transmission. According to this requirement, the paper proposes a design scheme of main information network based on Ethernet. A microprocessor TMS320F2812 and the Ethernet interface chip KSZ8851 are applied to set up the Ethernet communication module of the payloads. The paper illuminates the hardware realization of the scheme with these two chips, as well as the software which is composed of drivers of transceiver register, the data definition of the telemetering data format and the data packing upon UDP/IP protocol. UDP protocol allows the fastest and simple way of transmitting data to the receiver. CCSDS packet format as a standard protocol in space data transformation is adopted in the UDP data packets. The experiment results show that the communication module can successfully transmit the data between Science Experiment Payloads and LAPTOP(or Data management unit) with a good real-time performance in the simple point-to-point circumstance.
Keywords :
aerospace computing; information networks; local area networks; microprocessor chips; space communication links; transport protocols; CCSDS packet format; Ethernet communication module; KSZ8851 Ethernet interface chip; TMS320F2812 microprocessor; UDP data packets; UDP/IP protocol; data packing; information network; laptop; point-to-point circumstance; space data transformation; space science experiment payloads; telemetering data format; transceiver register drivers; Digital signal processing; IP networks; Payloads; Protocols; Registers; Software; Transceivers; DSP; Ethernet interface; KSZ8851; Space science experiment payloads; UDP protocol;
Conference_Titel :
Signal Processing (ICSP), 2014 12th International Conference on
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4799-2188-1
DOI :
10.1109/ICOSP.2014.7015038