DocumentCode :
2315225
Title :
Bistable resistive switching in hafnium-silicate thin films
Author :
Saleh, M.N. ; Belay, D.K.V.K. ; Kim, T. ; Elliman, Robert Glen
Author_Institution :
Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
fYear :
2010
fDate :
12-15 Dec. 2010
Firstpage :
185
Lastpage :
186
Abstract :
We report on the resistive switching mechanism of dc magnetron sputtered hafnium-silicates (HfxSi1-xO2) memory thin films. It is observed that the electroforming of these films depends on the thickness and stoichiometry of the insulator as well as on the size of the top electrode (TE). Both high-conducting state (ON) and low-conducting state (OFF) are non-polar and stable. The ratio of resistance of the ON and the OFF state is greater than 103. Both states, performed by dc voltage sweeping and applying short pulses, are stable over 104s at a read out voltage of 0.2V at 85°C, which are all essential properties for further resistive random access memory (RRAM) applications.
Keywords :
electrodes; electroforming; hafnium compounds; insulating thin films; random-access storage; sputtering; stoichiometry; switching; HfxSi1-xO2; HfxSi1-xO2 memory thin films; OFF state; ON state; RRAM applications; bistable resistive switching; dc magnetron sputtered hafnium-silicates; dc voltage sweeping; electroforming; hafnium silicate thin films; high-conducting state; insulator stoichiometry; insulator thickness; low-conducting state; resistance; resistive random access memory; resistive switching mechanism; short pulse application; temperature 85 degC; top electrode size; voltage 0.2 V; Amorphous magnetic materials; Electrical resistance measurement; Electronics industry; Resistance; Semiconductor device measurement; Switches; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices (COMMAD), 2010 Conference on
Conference_Location :
Canberra, ACT
ISSN :
1097-2137
Print_ISBN :
978-1-4244-7334-2
Electronic_ISBN :
1097-2137
Type :
conf
DOI :
10.1109/COMMAD.2010.5699730
Filename :
5699730
Link To Document :
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