• DocumentCode
    2317745
  • Title

    Improvement of breakdown strength by additives and curing conditions on XLPE insulation for power cable

  • Author

    Youn, Bok-Hee ; Cho, Dae-Hee ; Shim, Sung-Ik

  • Author_Institution
    Electr. Power Res. Lab., LG Cable Ltd., Gyeongbuk, South Korea
  • fYear
    2004
  • fDate
    19-22 Sept. 2004
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    In This work, dielectric strength of XLPE insulation with lamellar densities varied by means of additives and curing conditions was investigated. To increase lamellar density of XLPE insulating material, two kinds of additives were used and cooling rates were controlled as curing conditions. TEM and X-ray diffraction was used to investigate the degree of lamellar density varied by additives. For breakdown strength of XLPE insulation with additives and different cooling rates, the mold-type cable specimens were made and evaluated with Weibull plot parameter. From the results, it is observed that the additives improve the lamellar density. In addition, we found that the dielectric strength of samples manufactured under slow cooling rate is higher than rapid cooling one. TEM and XRD analysis showed that the density in the XLPE insulation at the interface significantly affects dielectric strength of XLPE insulation.
  • Keywords
    X-ray diffraction; XLPE insulation; additives; cooling; curing; electric breakdown; electric strength; power cable insulation; transmission electron microscopy; TEM; Weibull plot parameter; X-ray diffraction; XLPE insulation; XRD; additive; breakdown strength; cooling rate; cross-linked polyethylene; curing condition; lamellar density; mold-type cable specimens; power cable; transmission electron microscopy; Additives; Cable insulation; Cooling; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Power cables; Temperature control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-8447-4
  • Type

    conf

  • DOI
    10.1109/ELINSL.2004.1380586
  • Filename
    1380586