DocumentCode
2317745
Title
Improvement of breakdown strength by additives and curing conditions on XLPE insulation for power cable
Author
Youn, Bok-Hee ; Cho, Dae-Hee ; Shim, Sung-Ik
Author_Institution
Electr. Power Res. Lab., LG Cable Ltd., Gyeongbuk, South Korea
fYear
2004
fDate
19-22 Sept. 2004
Firstpage
347
Lastpage
350
Abstract
In This work, dielectric strength of XLPE insulation with lamellar densities varied by means of additives and curing conditions was investigated. To increase lamellar density of XLPE insulating material, two kinds of additives were used and cooling rates were controlled as curing conditions. TEM and X-ray diffraction was used to investigate the degree of lamellar density varied by additives. For breakdown strength of XLPE insulation with additives and different cooling rates, the mold-type cable specimens were made and evaluated with Weibull plot parameter. From the results, it is observed that the additives improve the lamellar density. In addition, we found that the dielectric strength of samples manufactured under slow cooling rate is higher than rapid cooling one. TEM and XRD analysis showed that the density in the XLPE insulation at the interface significantly affects dielectric strength of XLPE insulation.
Keywords
X-ray diffraction; XLPE insulation; additives; cooling; curing; electric breakdown; electric strength; power cable insulation; transmission electron microscopy; TEM; Weibull plot parameter; X-ray diffraction; XLPE insulation; XRD; additive; breakdown strength; cooling rate; cross-linked polyethylene; curing condition; lamellar density; mold-type cable specimens; power cable; transmission electron microscopy; Additives; Cable insulation; Cooling; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Power cables; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
ISSN
1089-084X
Print_ISBN
0-7803-8447-4
Type
conf
DOI
10.1109/ELINSL.2004.1380586
Filename
1380586
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