DocumentCode :
2318316
Title :
Wide Range Temperature Sensors for Harsh Environments
Author :
Elbuluk, M.E. ; Hammoud, A. ; Patterson, R.
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Akron, Akron, OH, USA
fYear :
2009
fDate :
4-8 Oct. 2009
Firstpage :
1
Lastpage :
6
Abstract :
Silicon-on-insulator (SOI) parts are designed for high temperature applications and the potential exists about their performance at cryogenic temperature conditions. In this paper, the performance of SOI devices and circuits were evaluated under extreme temperatures and thermal cycling. Two oscillator circuits were constructed using a new SOI 555 timer chip and used as temperature sensors in harsh environments encompassing jet engines and space mission applications. The circuits, were evaluated between -190degC and +200degC. The output of each circuit produced a stream of square pulses whose frequency was a function of the sensed temperature. The results indicate that both circuits performed relatively well over the entire test temperature range. In addition, the performance of either circuit did not undergo any change after subjecting the circuits to limited thermal cycling over the temperature regime of -190degC and +200degC, and the circuits were able to cold start at -195degC.
Keywords :
cryogenic electronics; high-temperature electronics; jet engines; oscillators; silicon-on-insulator; space vehicle electronics; temperature sensors; SOI 555 timer chip; Si-SiO2; cryogenic temperature; extreme temperature electronics; high temperature applications; jet engines; oscillator circuit; silicon-on-insulator; space mission; temperature -190 C to 200 C; thermal cycling; wide range temperature sensor; Circuit testing; Cryogenics; Frequency; Jet engines; Oscillators; Performance evaluation; Pulse circuits; Silicon on insulator technology; Space missions; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Society Annual Meeting, 2009. IAS 2009. IEEE
Conference_Location :
Houston, TX
ISSN :
0197-2618
Print_ISBN :
978-1-4244-3475-6
Type :
conf
DOI :
10.1109/IAS.2009.5324840
Filename :
5324840
Link To Document :
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