Title :
Analysis of AC breakdown of composite-insulation depending on gas pressure and solid insulation thickness
Author :
Jung, Hae-Eun ; Yun, Jae-Hun ; Lee, Chung ; Kang, Seong-Hwa ; Cho, Kyu-Boek ; Lim, Kee-Joe
Author_Institution :
Dept. of Electr. & Comput. Eng., Chungbuk Nat. Univ., Chungbuk
Abstract :
SF6 gas used widely as insulating component in electric power industry has excellent in insulation and arc extinguishing performance in gas-insulated switchgear. However, the concern about eco-friendly alternative gas is currently rising because SF6 gas is one of the main greenhouse gases. In this paper, dry-air and composite-insulation (dry-air + epoxy) as the alternative technology for SF6 gas insulation is studied. Under the gas pressure ranged from 0.1 to 0.6 MPa, the breakdown voltage of dry-air is measured in AC electric field. The data of composite-insulation are ac acquired by changing the thickness of epoxy used in each composite-insulation under the same condition. As a result, in case of dry-air, the gas pressure needs to be compressed as about 3 times as that of SF6 to maintain the same dielectric strength. When the epoxy is applied by the thickness, the breakdown voltage of composite-insulation is increased by the side of dry-air. However, the difference by the thickness does not exist almost.
Keywords :
composite insulators; electric breakdown; epoxy insulation; gaseous insulation; AC electric field; composite insulation; composite-insulation AC breakdown; dry-air insulation; dry-air-epoxy insulation; gas pressure; pressure 0.1 MPa to 0.6 MPa; solid insulation thickness; Dielectrics and electrical insulation; Electric breakdown; Electric fields; Electric variables measurement; Gas industry; Gas insulation; Global warming; Pressure measurement; Solids; Switchgear; ac breakdown voltage; composite insulation; dry air; solid insulation;
Conference_Titel :
Condition Monitoring and Diagnosis, 2008. CMD 2008. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-1621-9
Electronic_ISBN :
978-1-4244-1622-6
DOI :
10.1109/CMD.2008.4580293