• DocumentCode
    2318523
  • Title

    Convex optimization of wafer temperature trajectories for rapid thermal processing

  • Author

    Gyugyi, Paul J. ; Young Man Cho ; Franklin, Gene ; Kailath, Thomas

  • Author_Institution
    Inf. Syst. Lab., Stanford Univ., CA, USA
  • fYear
    1993
  • fDate
    13-16 Sep 1993
  • Firstpage
    409
  • Abstract
    In this paper, we expand on the framework for achieving the tight control of the wafer temperature essential in rapid thermal processing (RTP) of semiconductor wafers. In our previous paper (1992), we established a method for identifying a state-space model of an RTP system at a processing condition of interest and designing a linear quadratic Gaussian (LQG) controller for disturbance regulation. In this paper we describe how convex optimization is used to obtain an approximation to the desired trajectory, close enough to allow high gain feedback controllers to reduce temperature nonuniformity. Temperature errors less than 30°C peak-to-peak, limited almost entirely by our system geometry, were achieved throughout a typical wafer recipe, which included ramps from room temperature to 900°C and from 900°C to 600°C, at the rate of 40°C per second. The benefits of convex optimization together with the LQG feedback control are demonstrated by experimental results obtained from an RTP system
  • Keywords
    feedback; optimal control; optimisation; rapid thermal processing; semiconductor device manufacture; temperature control; 20 to 900 degC; 900 to 600 degC; LQG feedback control; convex optimization; disturbance regulation; linear quadratic Gaussian controller; rapid thermal processing; semiconductor wafers; temperature nonuniformity; wafer temperature trajectories; Constraint optimization; Control systems; Feedback control; Force feedback; Laboratories; Lamps; Rapid thermal processing; Semiconductor device modeling; Temperature control; US Government;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control Applications, 1993., Second IEEE Conference on
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    0-7803-1872-2
  • Type

    conf

  • DOI
    10.1109/CCA.1993.348257
  • Filename
    348257