• DocumentCode
    2318858
  • Title

    Investigation of the Spindt type cathode formation mechanism by simulation and experiments

  • Author

    Lee, Hangwoo ; Park, Youngjun ; Kim, Jaewan ; Choi, Junhee ; Kim, Jongmin

  • Author_Institution
    Display & Mater. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
  • fYear
    1998
  • fDate
    19-24 July 1998
  • Firstpage
    120
  • Lastpage
    121
  • Abstract
    In this article, the Spindt-type metal emitter formation mechanism is investigated by the real fabrication and the simulation. There are several factors closely related to emission characterizations required for field emission display. Among these factors, the aspect ratio (emitter height/bottom diameter of emitter) is the most important parameter mainly determined by the physical properties of evaporation materials and process condition. On the emitter tip, the emission current depends on the aspect ratio which affects the suitable current density for field emission display. When the metal emitter cone is fabricated by electron beam evaporator, the dependence of aspect ratio on the evaporation material and the evaporation condition is analyzed by the particle simulation using the modified ballistic deposition (BD) model at various conditions. Based on the result stated above, the formation mechanism of metal field emitter is analyzed with experimental data and the optimized process condition is obtained for the high aspect ratio.
  • Keywords
    cathodes; electron beam deposition; electron field emission; vacuum microelectronics; Spindt type cathode; aspect ratio; ballistic deposition model; current density; electron beam evaporation; fabrication; field emission display; metal field emitter; simulation; Atomic layer deposition; Cathodes; Fabrication; Flat panel displays; Insulation; Land surface temperature; Rough surfaces; Shape control; Substrates; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Microelectronics Conference, 1998. Eleventh International
  • Conference_Location
    Asheville, NC, USA
  • Print_ISBN
    0-7803-5096-0
  • Type

    conf

  • DOI
    10.1109/IVMC.1998.728671
  • Filename
    728671