• DocumentCode
    2319131
  • Title

    Package of VME pressure sensors

  • Author

    Xia, Shanhong ; Tao, Xinxin ; Jia, Shuisheng

  • Author_Institution
    Inst. of Electron., Acad. Sinica, Beijing, China
  • fYear
    1998
  • fDate
    19-24 July 1998
  • Firstpage
    154
  • Lastpage
    155
  • Abstract
    Package is one of the most important steps in fabricating vacuum microelectronic (VME) pressure sensors. This issue has received increasing interest in recent years. In this paper, we presents our new efforts in packaging VME pressure sensors.
  • Keywords
    microsensors; packaging; pressure sensors; vacuum microelectronics; VME pressure sensor; packaging; vacuum microelectronic device; Anodes; Biomembranes; Bonding processes; Cathodes; Electronics packaging; Insulation; Sensor arrays; Temperature sensors; Voltage; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Microelectronics Conference, 1998. Eleventh International
  • Conference_Location
    Asheville, NC, USA
  • Print_ISBN
    0-7803-5096-0
  • Type

    conf

  • DOI
    10.1109/IVMC.1998.728689
  • Filename
    728689
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2319131