Title :
Numerical analysis of heat transfer on PCB current carrying conductor along with an interface
Author :
Norhisham, C.S.M. ; Ismadi, B. ; Wani, J.I. ; Rahifa, R.
Author_Institution :
Fac. of Electr. Eng., Univ. Teknikal Malaysia Melaka, Durian Tunggal, Malaysia
Abstract :
This paper present a numerical one dimensional simulation of heat transfer on printed circuit board (PCB) current carrying conductor. A finite element method via Galerkin approach is applied to obtain the solution of heat transfer problem. A PCB has been designed and then an experiment has been performed for data collection. Analysis from the experiment data has been done and integrated with the simulation part. Both result from simulation and experiment is compared. The simulation result showed that there is a good agreement with the experimental result. It is proven that the algorithm can be applied to the heat transfer analysis of PCB. To show the result interactively, in this research there is a Graphical User Interface (GUI) developed for analysis of heat transfer.
Keywords :
Galerkin method; conductors (electric); electronic engineering computing; finite element analysis; graphical user interfaces; heat transfer; printed circuit design; GUI; Galerkin approach; PCB current carrying conductor; data collection; finite element method; graphical user interface; heat transfer analysis; numerical one dimensional simulation; printed circuit board current carrying conductor; Conductors; Copper; Finite element methods; Heat transfer; Heating; Mathematical model; User interfaces; Finite Element Method (FEM); Galerkin Approach; Heat Transfer; Printed Circuit Board (PCB);
Conference_Titel :
Open Systems (ICOS), 2011 IEEE Conference on
Conference_Location :
Langkawi
Print_ISBN :
978-1-61284-931-7
DOI :
10.1109/ICOS.2011.6079273
