DocumentCode
2320063
Title
Noise coupling analysis of the high speed memory module
Author
Kim, Jung-Min ; Du, Jin-Kyung ; Yuk, Jai-Rim ; Yook, Jong-Gwan
Author_Institution
Yonsei Univ., Seoul
fYear
2007
fDate
9-15 June 2007
Firstpage
3948
Lastpage
3951
Abstract
In this paper, noise coupling phenomena generated from DDR2 memory module is observed by combinations of 2D finite element method and SPICE based simulator. Noise coupling effect is mainly caused by the discontinuity of the reference plane, so the power & ground referenced signal is designed and calculated on the DDR2 module. Then, frequency and time domain calculations are performed in order to observe the noise coupling phenomena.
Keywords
DRAM chips; electromagnetic interference; finite element analysis; interference suppression; 2D finite element method; DDR2 memory module; dual in-line memory module; electromagnetic interference; interference suppression; noise coupling effect; Circuit noise; Clocks; Electromagnetic interference; Electronics packaging; Noise generators; Power transmission lines; Printed circuits; SPICE; Signal design; Signal processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2007 IEEE
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-0877-1
Electronic_ISBN
978-1-4244-0878-8
Type
conf
DOI
10.1109/APS.2007.4396404
Filename
4396404
Link To Document