DocumentCode :
2320063
Title :
Noise coupling analysis of the high speed memory module
Author :
Kim, Jung-Min ; Du, Jin-Kyung ; Yuk, Jai-Rim ; Yook, Jong-Gwan
Author_Institution :
Yonsei Univ., Seoul
fYear :
2007
fDate :
9-15 June 2007
Firstpage :
3948
Lastpage :
3951
Abstract :
In this paper, noise coupling phenomena generated from DDR2 memory module is observed by combinations of 2D finite element method and SPICE based simulator. Noise coupling effect is mainly caused by the discontinuity of the reference plane, so the power & ground referenced signal is designed and calculated on the DDR2 module. Then, frequency and time domain calculations are performed in order to observe the noise coupling phenomena.
Keywords :
DRAM chips; electromagnetic interference; finite element analysis; interference suppression; 2D finite element method; DDR2 memory module; dual in-line memory module; electromagnetic interference; interference suppression; noise coupling effect; Circuit noise; Clocks; Electromagnetic interference; Electronics packaging; Noise generators; Power transmission lines; Printed circuits; SPICE; Signal design; Signal processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2007 IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-0877-1
Electronic_ISBN :
978-1-4244-0878-8
Type :
conf
DOI :
10.1109/APS.2007.4396404
Filename :
4396404
Link To Document :
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