DocumentCode
2320428
Title
Architecture of a vertically stacked reconfigurable computer
Author
Stevenson, Daniel S. ; Conn, Robert O.
fYear
2008
fDate
16-16 Nov. 2008
Firstpage
1
Lastpage
6
Abstract
This paper describes a scalable reconfigurable computing system using a Silicon circuit board (SiCB) design approach. The design involves attachment of unpackaged FPGA and memory die to wafer scale silicon substrates. The resulting reconfigurable computing system has substantial density, cost, and power consumption and performance improvements relative to other known integration or construction methods. A description of the SiCB technology and detailed advantages are provided. In addition, the reconfigurable computer architecture resulting from the use of SiCBs is described.
Keywords
elemental semiconductors; field programmable gate arrays; printed circuit design; silicon; substrates; FPGA; memory; silicon circuit board design; vertically stacked reconfigurable computer; wafer scale silicon substrates; Computer architecture; Energy consumption; Fabrication; Field programmable gate arrays; Integrated circuit interconnections; Integrated circuit technology; Packaging; Printed circuits; Sensor arrays; Silicon on insulator technology; Computer architecture; field programmable gate arrays; reconfigurable architectures; vertically integrated packaging; wafer scale;
fLanguage
English
Publisher
ieee
Conference_Titel
High-Performance Reconfigurable Computing Technology and Applications, 2008. HPRCTA 2008. Second International Workshop on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-2826-7
Type
conf
DOI
10.1109/HPRCTA.2008.4745678
Filename
4745678
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