• DocumentCode
    2320536
  • Title

    Vertical integrated transformer using bondwires for MMICs

  • Author

    Byung-Wook Song ; Sung-Jin Kim ; Hai-Young Lee

  • Author_Institution
    Dept. of Electron. Eng., Ajou Univ., Suwon, South Korea
  • Volume
    3
  • fYear
    2000
  • fDate
    11-16 June 2000
  • Firstpage
    1341
  • Abstract
    Novel vertical integrated transformers using bondwires are proposed and fabricated for low-cost and high performance MMICs. The new bondwire transformers are characterized experimentally in a wide frequency range from 1 to 20 GHz. The new transformers show lower power loss due to small ohmic loss of the gold bondwires and wide bandwidth compared to those of the planar spiral transformer.
  • Keywords
    Impedance matching; Lead bonding; Losses; MMIC; Transformers; 1 to 20 GHz; MMICs; bandwidth; bondwires; ohmic loss; power loss; vertical integrated transformer; Costs; Fabrication; Gallium arsenide; Gold; Manufacturing; Microstrip; Parasitic capacitance; Spirals; Substrates; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest. 2000 IEEE MTT-S International
  • Conference_Location
    Boston, MA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-5687-X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2000.861789
  • Filename
    861789
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2320536