DocumentCode :
2320938
Title :
A critical discussion of the current collapse in multifinger HBTs based on Floquet stability analysis
Author :
Traversa, F.L. ; Cappelluti, F. ; Bonani, F.
Author_Institution :
Dipt. di Elettron., Politec. di Torino, Turin
fYear :
2008
fDate :
24-25 Nov. 2008
Firstpage :
21
Lastpage :
24
Abstract :
The paper presents a critical discussion of the electro-thermal instability in multifinger HBTs based on Floquet Multipliers analysis. We show that the usual interpretation of current collapse as a bifurcation phenomenon for layouts with more than two fingers strictly holds only if inter-finger thermal coupling is neglected. Thus, predictive criteria based on the identification of singularity points associated to the nonlinear system may result inaccurate, or even fail, for the analysis of practical devices. On the other hand, numerical results show that a predictive analysis associated to the behavior of the FMs may still be provided. Finally, the proposed approach is applied to the stability analysis of different designs exploiting emitter ballasting or thermal shunt stabilization.
Keywords :
bifurcation; heterojunction bipolar transistors; semiconductor device reliability; thermal stability; Floquet multiplier analysis; Floquet stability analysis; bifurcation phenomenon; current collapse; electro-thermal instability; emitter ballasting; multifinger HBT; nonlinear system; predictive analysis; singularity point; thermal shunt stabilization; Bifurcation; Bipolar integrated circuits; Electronic ballasts; Failure analysis; Fingers; Flexible manufacturing systems; Heterojunction bipolar transistors; Nonlinear systems; Stability analysis; Temperature distribution; Electrothermal effects; Heterojunction bipolar transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Nonlinear Microwave and Millimetre-Wave Circuits, 2008. INMMIC 2008. Workshop on
Conference_Location :
Malaga
Print_ISBN :
978-1-4244-2645-4
Electronic_ISBN :
978-1-4244-2646-1
Type :
conf
DOI :
10.1109/INMMIC.2008.4745704
Filename :
4745704
Link To Document :
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