Title :
Automotive electronics IC reliability
Author_Institution :
Delco Electron. Corp., Kokomo, IN, USA
Abstract :
Some of the outstanding automotive electronics plastic-encapsulated IC reliability trends observed over the past few years are discussed, reliability and growth are forecast based on observed trends, and the reliability goal of 0.1 PPM cumulative at 5 years or 50000 miles by the year 2001 is revealed. Analysis of data shows where continuous improvement of IC designs, processing, handling, and testing should be focused to meet this goal
Keywords :
automotive electronics; circuit reliability; encapsulation; monolithic integrated circuits; packaging; IC reliability; automotive electronics; plastic-encapsulated IC; Automotive electronics; Automotive engineering; CMOS technology; Continuous improvement; Data analysis; Electronic equipment testing; Integrated circuit reliability; Integrated circuit testing; Packaging; Temperature;
Conference_Titel :
Custom Integrated Circuits Conference, 1990., Proceedings of the IEEE 1990
Conference_Location :
Boston, MA
DOI :
10.1109/CICC.1990.124777
