Title :
An integrated system for circuit level hot-carrier evaluation
Author :
Tsui, Paul Y. ; Howington, Lee ; Lee, Peter ; Tiwald, Tom ; Mowry, Brian ; Baker, Frank ; Hayden, Jim ; Feaster, Bill ; Garbs, Bob
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
An integrated system designed to evaluate and predict hot-carrier effects at the circuit level is described. The system will perform device stress, collect data, extract parameters, and simulate circuit aging behavior using the circuit aging simulator from UC Berkeley. Enhancements made to the device-stress and data-analysis portions of the system were found necessary to achieve accurate circuit reliability prediction. Less than 2% error is observed between the measured and simulated performance of a 0.5 μm ring oscillator test circuit
Keywords :
ageing; circuit analysis computing; circuit reliability; data analysis; digital simulation; hot carriers; integrated circuit technology; circuit aging simulator; circuit level hot-carrier evaluation; circuit reliability prediction; data-analysis; device stress; integrated system; model parameter extraction capability; Aging; Circuit simulation; Circuit testing; Content addressable storage; Data analysis; Data mining; Degradation; Hot carrier effects; Hot carriers; Stress;
Conference_Titel :
Custom Integrated Circuits Conference, 1990., Proceedings of the IEEE 1990
Conference_Location :
Boston, MA
DOI :
10.1109/CICC.1990.124779
