• DocumentCode
    2321532
  • Title

    Development of heat-resistant, solderable, triple-insulated winding wire

  • Author

    Kim, Yong Hoon ; Ishii, Tadashi ; Kobayashi, Isamu

  • Author_Institution
    Furukawa Electr. Co. Ltd., Kanagawa, Japan
  • fYear
    2003
  • fDate
    23-25 Sept. 2003
  • Firstpage
    101
  • Lastpage
    104
  • Abstract
    To meet the trend in power supply units toward downsizing and higher efficiency, we have developed heat-resistant (class B), solderable, triple-insulated winding wire with using technologies of polymer alloy and thin insulation. Modified polyethersulfone resin was applied to a 1st and 2nd layer for achieving both heat-resistance and solderability. And poly (phenylene sulfide) was selected as a 3rd layer for improving chemical-resistance of the winding wire. It was confirmed that the newly developed wire has class B heat resistance according to safety standards relating to switching power supplies, and features excellent electrical endurance and a high voltage for the inception of partial discharge.
  • Keywords
    extrusion; insulated wires; organic insulating materials; partial discharges; polymer blends; resins; thermal resistance; chemical resistance; class B heat resistance; electrical endurance; heat resistant winding wire; partial discharge inception voltage; polyethersulfone resin; polymer alloy; polyphenylene sulfide; power supply units; solderability; solderable winding wire; thin insulation; triple insulated winding wire; Cable insulation; Chemicals; Electric resistance; Electrical safety; Plastic insulation; Polymers; Power supplies; Resins; Standards development; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Technology Conference, 2003. Proceedings
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-7935-7
  • Type

    conf

  • DOI
    10.1109/EICEMC.2003.1247863
  • Filename
    1247863