DocumentCode
2321805
Title
Packaging effects of a broadband 60 GHz cavity-backed folded dipole superstrate antenna
Author
Grzyb, Janusz ; Liu, Duixian ; Gaucher, Brian
Author_Institution
Huber + Suhner AG, Herisau
fYear
2007
fDate
9-15 June 2007
Firstpage
4365
Lastpage
4368
Abstract
A broadband and high-efficiency 60GHz folded dipole antenna integrated in a plastic package technology was presented. Its performance showed an extremely low sensitivity to the variable surrounding package and board level environments, which is of importance at mmWave frequencies. Furthermore, the presence of the silicon chip in a plastic package can be important for the antenna gain bandwidth enhancement.
Keywords
broadband antennas; dipole antennas; plastic packaging; broadband cavity-backed folded dipole superstrate antenna; folded dipole antenna; frequency 60 GHz; plastic package technology; Antenna feeds; Antenna measurements; Broadband antennas; Chip scale packaging; Dipole antennas; Encapsulation; Frequency measurement; Plastic packaging; Semiconductor device measurement; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2007 IEEE
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-0877-1
Electronic_ISBN
978-1-4244-0878-8
Type
conf
DOI
10.1109/APS.2007.4396509
Filename
4396509
Link To Document