• DocumentCode
    232229
  • Title

    A new method of locating the single wire fault

  • Author

    Qinghai Shi ; Kanoun, Olfa

  • Author_Institution
    Meas. & Sensor Technol., Tech. Univ. Chemnitz, Chemnitz, Germany
  • fYear
    2014
  • fDate
    19-23 Oct. 2014
  • Firstpage
    2262
  • Lastpage
    2267
  • Abstract
    A new technique is proposed to detect and locate the wire fault using impedance spectroscopy (IS). Impedance Spectroscopy (IS) is applied to measure the input impedance of the wiring system. The load impedance of the wire fault can be abstracted from the input impedance in order to identify the type of wire faults. The input impedance is a period function of the frequency and the period of this function is linearly proportional to the distance to the fault. The fast Fourier transform of the input impedance can give a single spike to locate the wire fault. This novel method enables the location of hard (open and short circuits) and soft (wire faults with small impedance changes) faults. The input impedance of the wire faults in the defined low frequency range can be applied to identify the types of wire faults. The capacitance and inductance of the cable system can be applied to detect the wire fault if it is open or short circuit. The absolute deviation of the wire fault location in this study is maximal 40 cm and is independent on the distance to a wire faults.
  • Keywords
    electric impedance measurement; fast Fourier transforms; fault location; twisted pair cables; cable system; capacitance; fast Fourier transform; impedance spectroscopy; inductance; input impedance measurement; open circuit; short circuit; wire fault detection; wire fault location; wiring system; Circuit faults; Fault location; Impedance; Power cables; Wires; Wiring; Impedance Spectroscopy (IS); impedance of the wire faults; twisted-pair cable; type of the wire faults; wire faults location;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing (ICSP), 2014 12th International Conference on
  • Conference_Location
    Hangzhou
  • ISSN
    2164-5221
  • Print_ISBN
    978-1-4799-2188-1
  • Type

    conf

  • DOI
    10.1109/ICOSP.2014.7015397
  • Filename
    7015397