DocumentCode
2322811
Title
Evanescent microwave microscopy of thermally-damaged charge coupled devices
Author
Kleismit, Richard A. ; Kazimierczuk, Marian K.
Author_Institution
Wright State Univ., Dayton, OH, USA
fYear
2003
fDate
23-25 Sept. 2003
Firstpage
485
Lastpage
488
Abstract
Evanescent Microwave Probe (EMP) scanning is used to detect thermal damage in silicon (Charge Coupled Device) CCD arrays. The CCD is a solid-state chip that turns light into electric signals and essentially functions as a camera-on-a-chip. These devices have been used on flight missions such as the Galileo mission to Jupiter and the Hubble space telescope. The primary interest is in the amount of damage these devices can withstand and remain functional. Evanescent microwave probes have the unique ability to image subsurface features under semi-conducting or dielectric materials. This nondestructive evaluation technique will allow fast and highly accurate surface/subsurface scans of damaged CCD array devices.
Keywords
CCD image sensors; dielectric materials; microwave detectors; nondestructive testing; scanning probe microscopy; silicon; Galileo mission; Hubble space telescope; Jupiter; Si; camera-on-chip; dielectric materials; electric signals; evanescent microwave microscopy; evanescent microwave probe scanning; near field imaging; nondestructive evaluation technique; silicon CCD arrays; solid state chip; surface scans; thermally damaged charge-coupled devices; Charge coupled devices; Charge-coupled image sensors; EMP radiation effects; Jupiter; Microscopy; Microwave antenna arrays; Microwave devices; Probes; Silicon; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Technology Conference, 2003. Proceedings
ISSN
0362-2479
Print_ISBN
0-7803-7935-7
Type
conf
DOI
10.1109/EICEMC.2003.1247934
Filename
1247934
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