• DocumentCode
    2325528
  • Title

    Effect of one dimensional quantum structures on the thermoelectric figure of merit

  • Author

    Casian, A. ; Sur, I. ; Sandu, A. ; Scherrer, H. ; Scherrer, S.

  • Author_Institution
    Moldova Tech. Univ., Kishinau, Moldova
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    442
  • Lastpage
    445
  • Abstract
    Recently it was shown theoretically that the thermoelectric properties of certain materials can be enhanced very much by preparing them in the form of one-dimensional conductors or quantum wires. For this it was supposed that the carrier mobility is the same both in quantum wire and in bulk material. Using the model of quasi-one-dimensional cylindrical quantum wire of finite radius with infinite potential confinement, we have calculated the mobility as a function of wire thickness. The carrier scattering both on optical and acoustical phonons is taken into account. It is found that the mobility decreases with wire thickness, decreasing from values greater than to values much smaller than the bulk one. This result changes drastically the conclusion about significant increases in the figure of merit of materials by preparing them in form of quantum wire structures
  • Keywords
    carrier mobility; electron-phonon interactions; semiconductor quantum wires; thermoelectricity; 1D conductors; 1D quantum structures; acoustical phonons scattering; carrier mobility; carrier-phonon scattering; finite radius; infinite potential confinement; optical phonons scattering; quantum wires; quasi-1D cylindrical quantum wire; thermoelectric figure of merit; thermoelectric properties; wire thickness dependence; Acoustic scattering; Carrier confinement; Conducting materials; Optical materials; Optical scattering; Particle scattering; Phonons; Quantum mechanics; Thermoelectricity; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.667182
  • Filename
    667182