• DocumentCode
    2326172
  • Title

    Dual stack method: A novel approach to low leakage and speed power product VLSI design

  • Author

    Islam, M.S. ; Nasrin, M. Sultana ; Mansur, Nuzhat ; Tasneem, Naila

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
  • fYear
    2010
  • fDate
    18-20 Dec. 2010
  • Firstpage
    89
  • Lastpage
    92
  • Abstract
    The development of digital integrated circuits is challenged by higher power consumption. The combination of higher clock speeds, greater functional integration, and smaller process geometries has contributed to significant growth in power density. Scaling improves transistor density and functionality on a chip. Scaling helps to increase speed and frequency of operation and hence higher performance. As voltages scale downward with the geometries threshold voltages must also decrease to gain the performance advantages of the new technology but leakage current increases exponentially. Today leakage power has become an increasingly important issue in processor hardware and software design. In 65 nm and below technologies, leakage accounts for 30-40% of processor power. In this paper, we propose a new dual stack approach for reducing both leakage and dynamic powers. Moreover, the novel dual stack approach shows the least speed power product when compared to the existing methods.
  • Keywords
    VLSI; leakage currents; low-power electronics; chip functionality; digital integrated circuit; dual stack method; dynamic power; leakage current; leakage power; power density; processor hardware; processor power; software design; speed power product VLSI design; threshold voltage; transistor density; voltages scale; Dual stack; dual V-th; state saving technique; static power reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering (ICECE), 2010 International Conference on
  • Conference_Location
    Dhaka
  • Print_ISBN
    978-1-4244-6277-3
  • Type

    conf

  • DOI
    10.1109/ICELCE.2010.5700560
  • Filename
    5700560