Chip multilayer antenna for 2.45 GHz-band application using LTCC technology

Author

Dakeya, Y. ; Suesada, T. ; Asakura, K. ; Nakajima, N. ; Mandai, H.

Author_Institution

Dept. of Multilayer Components, Murata Manuf. Co. Ltd., Shiga, Japan

Volume

3

fYear

2000

fDate

11-16 June 2000

Firstpage

1693

Abstract

Utilizing the radiation from not only the antenna but GND plane of antenna-mounted terminals can contribute to reduce the size and weight of a chip antenna drastically without spoiling high performance. The optimization of the mounting conditions for the chip multilayer antenna is indispensable to realize higher performances. A wide bandwidth of more than 100 MHz (VSWR<2) is required for the 2.45 GHz applications such as Bluetooth, Home-RF and so on. This paper investigates optimization of the mounting conditions for the chip antenna. The chip multilayer antenna is a suitable antenna for 2.45 GHz-band applications under the optimized mounting conditions.

Keywords

Ceramic packaging; Finite difference time-domain analysis; Mobile antennas; UHF antennas; Wireless LAN; 2.45 GHz; Bluetooth; Home-RF; LTCC technology; chip multilayer antenna; mobile antennas; mounting conditions; Antenna accessories; Bandwidth; Bluetooth; Dipole antennas; Material properties; Nonhomogeneous media; Performance gain; Radio frequency; Resonance; Resonant frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.862304

Filename

862304