Title :
Characterization of surface mount packages at microwave frequencies using wafer probes
Author_Institution :
Maxim Integrated Products, Beaverton, OR, USA
Abstract :
Calibrated measurements are performed in a printed circuit board (PCB) environment using microstrip elements and ultra-small surface mount components as calibration standards. The calibration technique allows surface mount packages to be characterized from VHF to microwave frequencies. The use of microwave wafer probes for connection to the PCB is described.
Keywords :
Calibration; Microstrip transitions; Microwave measurement; Printed circuit accessories; Printed circuit testing; Probes; Surface mount technology; CPW to microstrip transition model; PCB connection; VHF frequency; calibrated measurements; calibration standards; microstrip elements; microwave frequency characterization; microwave wafer probes; printed circuit board environment; surface mount packages; ultra-small surface mount components; wafer probes; Calibration; Coplanar waveguides; Integrated circuit modeling; Microstrip components; Microwave frequencies; Packaging; Printed circuits; Probes; Semiconductor device modeling; Surface-mount technology;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.862350
