DocumentCode :
2328898
Title :
Required Manufacturing Capabilities For Competitive Dfvicf Manufacturers In The Year 2000
Author :
Siegle, W.T.
Author_Institution :
Advanced Micro Devices
fYear :
1994
fDate :
21-22 June 1994
Firstpage :
6
Lastpage :
9
Abstract :
In a few short years, we will begin a new century. The remarkable progress we have seen in the integrated correct industry in this century will certainly continue into the next. But we all know that this difficult and competitive industry will continue to get more difficult as we move through successive generations into the next decade and century. I would like to discuss four aspects of the technology as we begin this next interval of progress, and the challenges they pose to those who expect to be successful and profitable continuing in this business. The four areas are: (1) lithography, (2) interconnect technology, (3) gate oxide and isolation methods, and (4) factory utilization. Success in these endeavors will help assure business success to those in the business. I say help assure success, for these are necessary but not sufficient conditions for success. The remaining area, which I will not discuss, needed to assure success is the identification of applications, and their execution in design and implementation if timely market introduction and acceptance is to occur.
Keywords :
Costs; Dielectric materials; Isolation technology; Lithography; Maintenance engineering; Manufacturing; Optical films; Optical refraction; Transistors; Ultraviolet sources;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location :
Tokyo, Japan
Type :
conf
DOI :
10.1109/ISSM.1994.729411
Filename :
729411
Link To Document :
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