• DocumentCode
    2329362
  • Title

    Challenges for silicon technology scaling in the Nanoscale Era

  • Author

    Chen, Tze-Chiang

  • Author_Institution
    IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    The continuous and systematic increase in transistor density and performance, as described in ldquoMoore´s Lawrdquo and guided by CMOS scaling theory, has been remarkably successful for the development of silicon technology for the past 40 years. As the silicon industry moves into sub-ten nanometer dimensions, significant technology challenges in device performance, power dissipation, and variability will be imposed by the approach toward atomistic and quantum-mechanical physics boundaries. These issues are frequently cited as the reason Moore´s Law is ldquobrokenrdquo, or why CMOS scaling is coming to an end. However, the infusion of new materials, device structures, and the exploitation of 3D-silicon integration, coupled with innovations in circuit design and system architecture, will ensure several more generations of continued CMOS development.
  • Keywords
    CMOS integrated circuits; elemental semiconductors; nanotechnology; quantum theory; silicon; 3D-silicon integration exploitation; CMOS scaling theory; Moore law; Si; atomistic approach; circuit design; continued CMOS development; device performance; device structures; device variability; material infusion; nanoscale era; power dissipation; quantum-mechanical physics boundary; silicon technology scaling; system architecture; transistor density; CMOS technology; Composite materials; Compressive stress; Inorganic materials; MOSFETs; Moore´s Law; Nanoscale devices; Semiconductor materials; Silicon; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ESSCIRC, 2009. ESSCIRC '09. Proceedings of
  • Conference_Location
    Athens
  • ISSN
    1930-8833
  • Print_ISBN
    978-1-4244-4354-3
  • Type

    conf

  • DOI
    10.1109/ESSCIRC.2009.5325955
  • Filename
    5325955