• DocumentCode
    2329440
  • Title

    Eouipment Modeling: A Tool To Cost Reduction

  • Author

    Alvi, N.S.

  • Author_Institution
    SEMATECH
  • fYear
    1994
  • fDate
    21-22 June 1994
  • Firstpage
    123
  • Lastpage
    128
  • Abstract
    Complexities in manufacturing and needs for cost containment have spawned a drive to develop accurate and efficient modeling techniques. These range from addressing market scenarios and factory performance at the strategic level to the performance of individual equipment at the tactical level, such as throughput, clustering and reliability. The modeling of individual equipment and process is an important link in the overall drive to comprehend and reduce cost factors at the factory level. This paper describes the application of analytical and computational modeling techniques used to optimize process and equipment design of furnace, chemical vapor deposition (CVD), rapid thermal processing (RTP), and plasma etch and deposition equipment.
  • Keywords
    Chemical vapor deposition; Computational modeling; Costs; Design optimization; Etching; Plasma applications; Plasma chemistry; Plasma materials processing; Process design; Production facilities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
  • Conference_Location
    Tokyo, Japan
  • Type

    conf

  • DOI
    10.1109/ISSM.1994.729437
  • Filename
    729437