DocumentCode
2329440
Title
Eouipment Modeling: A Tool To Cost Reduction
Author
Alvi, N.S.
Author_Institution
SEMATECH
fYear
1994
fDate
21-22 June 1994
Firstpage
123
Lastpage
128
Abstract
Complexities in manufacturing and needs for cost containment have spawned a drive to develop accurate and efficient modeling techniques. These range from addressing market scenarios and factory performance at the strategic level to the performance of individual equipment at the tactical level, such as throughput, clustering and reliability. The modeling of individual equipment and process is an important link in the overall drive to comprehend and reduce cost factors at the factory level. This paper describes the application of analytical and computational modeling techniques used to optimize process and equipment design of furnace, chemical vapor deposition (CVD), rapid thermal processing (RTP), and plasma etch and deposition equipment.
Keywords
Chemical vapor deposition; Computational modeling; Costs; Design optimization; Etching; Plasma applications; Plasma chemistry; Plasma materials processing; Process design; Production facilities;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location
Tokyo, Japan
Type
conf
DOI
10.1109/ISSM.1994.729437
Filename
729437
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