Title :
Chip to chip communications for terabit transmission rates
Author :
Moore, B. ; Sellathamby, C. ; Slupsky, S. ; Iniewski, K.
Author_Institution :
Scanimetrics Inc., Edmonton, AB
fDate :
Nov. 30 2008-Dec. 3 2008
Abstract :
I/O data throughput remains a bottleneck in high-speed chip to chip data communication. This paper discusses the latest technical innovations in increasing the I/O bandwidth while reducing energy per transition. Both wireline techniques that include DSP processing and equalization, and wireless transmissions that include on-chip inductive and capacitive coupling are discussed and compared.
Keywords :
digital signal processing chips; DSP processing; I/O bandwidth; capacitive coupling; chip to chip communications; data communication; terabit transmission rates; Bandwidth; Couplings; Optical fiber communication; Optical filters; Optical interconnections; Optical modulation; Power dissipation; Throughput; Transceivers; Wireless communication;
Conference_Titel :
Circuits and Systems, 2008. APCCAS 2008. IEEE Asia Pacific Conference on
Conference_Location :
Macao
Print_ISBN :
978-1-4244-2341-5
Electronic_ISBN :
978-1-4244-2342-2
DOI :
10.1109/APCCAS.2008.4746331
