DocumentCode :
2329520
Title :
Defect Reduction Using Yield Management Test Structures
Author :
Chou, H.M. ; Liu, C.C. ; Kuo, C.J. ; Hwang, J.H. ; Wu, N.W. ; Chang, M.C.
Author_Institution :
ERSO Sub-uM Fab, ITRI
fYear :
1994
fDate :
21-22 June 1994
Firstpage :
147
Lastpage :
150
Abstract :
Design and applications of Yield Management test patterns on memory products have been reviewed. Evaluations are made for Y.M. patterns and conventional T.K. patterns in terms of their ability to faithfully point out process deviations/defects and to predict CP yield. It s assessed that Y.M. patterns are superior to T.K. patterns in terms of the previous criteria. Finally, design guidelines will be also discussed.
Keywords :
Chemical processes; Costs; Guidelines; Inspection; Manufacturing; Memory management; Polymers; Probes; Testing; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location :
Tokyo, Japan
Type :
conf
DOI :
10.1109/ISSM.1994.729442
Filename :
729442
Link To Document :
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