Title :
A high-frequency power amplifier using GaN power cell technology
Author :
Li, Ming ; Amaya, Rony E.
Author_Institution :
Commun. Res. Centre Canada, Ottawa, ON, Canada
Abstract :
This paper describes the design, simulation, packaging and measurement of a 10-GHz Gallium Nitride power amplifier (PA). GaN transistors or power cells with maximum-available gain of 8.7 dB at 10 GHz were used in the design. The power cells were manufactured using a 0.8-¿m HFET 9-layer process, while the PA´s DC bias lines, input and output matching circuits were built on a low-cost Miniature-Hybrid MIC chip. A flip-chip technology was used to integrate the power cells with the rest of the PA circuit. A class-AB PA was designed to provide an output power of up to 39 dBm at 10 GHz, while maintaining a power-added efficiency (PAE) of 31%. The measurements of the PA are presented and issues related to packaging and measurements are also discussed in the paper.
Keywords :
III-V semiconductors; electronics packaging; field effect MMIC; field effect transistors; flip-chip devices; gallium compounds; microwave power amplifiers; wide band gap semiconductors; DC bias lines; GaN; HFET; flip-chip technology; frequency 10 GHz; high-frequency power amplifier; input matching circuits; maximum-available gain; output matching circuits; packaging; power cell technology; power-added efficiency; size 0.8 mum; Gain; Gallium nitride; HEMTs; High power amplifiers; III-V semiconductor materials; Integrated circuit measurements; Manufacturing processes; Packaging; Power amplifiers; Power measurement; Gallium Nitride; flip-chip technology; high frequency; power amplifier; silicon-carbide;
Conference_Titel :
Wireless and Microwave Technology Conference (WAMICON), 2010 IEEE 11th Annual
Conference_Location :
Melbourne, FL
Print_ISBN :
978-1-4244-6688-7
DOI :
10.1109/WAMICON.2010.5461887