• DocumentCode
    2330127
  • Title

    A self-adjusting clock tree architecture to cope with temperature variations

  • Author

    Long, Jieyi ; Ku, Ja Chun ; Memik, Seda Ogrenci ; Ismail, Yehea

  • Author_Institution
    Northwestern Univ., Evanston
  • fYear
    2007
  • fDate
    4-8 Nov. 2007
  • Firstpage
    75
  • Lastpage
    82
  • Abstract
    Ensuring resilience against environmental variations is becoming one of the great challenges of chip design. In this paper, we propose a self adjusting clock tree architecture, SACTA, to improve chip performance and reliability in the presence of on-chip temperature variations. SACTA performs temperature dependent dynamic clock skew scheduling to prevent timing violations in a pipelined circuit. We present an automatic temperature adjustable skew buffer design, which enables the adaptive feature of SACTA. Furthermore, we propose an efficient and general optimization framework to determine the configuration of these special delay elements. Experimental results show that a pipeline supported by SACTA is able to prevent thermal induced timing violations within a significantly larger range of operating temperatures (enhancing the violation-free range by as much as 45degC).
  • Keywords
    buffer circuits; clocks; delay circuits; microprocessor chips; system-on-chip; SACTA; automatic temperature adjustable skew buffer design; chip design; chip performance; chip reliability; delay elements; environmental variation resilience; on-chip temperature variations; self adjusting clock tree architecture; self-adjusting clock tree architecture; temperature dependent dynamic clock skew scheduling; Chip scale packaging; Circuits; Clocks; Delay; Dynamic scheduling; Pipelines; Resilience; Temperature dependence; Temperature distribution; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-1381-2
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2007.4397247
  • Filename
    4397247