DocumentCode
2330143
Title
Wire density driven top-down global placement for CMP variation control
Author
Dong, Changdao ; Zhou, Qiang ; Cai, Yici ; Hong, Xianlong
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing
fYear
2008
fDate
Nov. 30 2008-Dec. 3 2008
Firstpage
1676
Lastpage
1679
Abstract
In this paper, we present a top-down global placement algorithm considering wire density uniformity for CMP variation control. The proposed algorithm is based on top-down recursive bisection framework. Wire weight balancing constraint is employed into bisection to consider wire density uniformity. A multilevel hypergraph partitioning satisfying balancing constraints on not only cell area but also wire weight is performed to acquire more uniform wire distribution. Empirical wire weight model is used to estimate wire density distribution before each bisection of a placement bin. Experimental results show that our algorithm improves ROOSTER with more uniform wire distribution by 3.1% on average and limited increment of wire length by 3.0%.
Keywords
chemical mechanical polishing; graph theory; integrated circuit interconnections; wires (electric); CMP variation control; ROOSTER; chemical-mechanical polishing; multilevel hypergraph partitioning; uniform wire distribution; wire density driven top-down global placement; wire weight balancing; Chemical technology; Computer science; Copper; Filling; Information science; Laboratories; Partitioning algorithms; Predictive models; Routing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2008. APCCAS 2008. IEEE Asia Pacific Conference on
Conference_Location
Macao
Print_ISBN
978-1-4244-2341-5
Electronic_ISBN
978-1-4244-2342-2
Type
conf
DOI
10.1109/APCCAS.2008.4746360
Filename
4746360
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