• DocumentCode
    2330143
  • Title

    Wire density driven top-down global placement for CMP variation control

  • Author

    Dong, Changdao ; Zhou, Qiang ; Cai, Yici ; Hong, Xianlong

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing
  • fYear
    2008
  • fDate
    Nov. 30 2008-Dec. 3 2008
  • Firstpage
    1676
  • Lastpage
    1679
  • Abstract
    In this paper, we present a top-down global placement algorithm considering wire density uniformity for CMP variation control. The proposed algorithm is based on top-down recursive bisection framework. Wire weight balancing constraint is employed into bisection to consider wire density uniformity. A multilevel hypergraph partitioning satisfying balancing constraints on not only cell area but also wire weight is performed to acquire more uniform wire distribution. Empirical wire weight model is used to estimate wire density distribution before each bisection of a placement bin. Experimental results show that our algorithm improves ROOSTER with more uniform wire distribution by 3.1% on average and limited increment of wire length by 3.0%.
  • Keywords
    chemical mechanical polishing; graph theory; integrated circuit interconnections; wires (electric); CMP variation control; ROOSTER; chemical-mechanical polishing; multilevel hypergraph partitioning; uniform wire distribution; wire density driven top-down global placement; wire weight balancing; Chemical technology; Computer science; Copper; Filling; Information science; Laboratories; Partitioning algorithms; Predictive models; Routing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2008. APCCAS 2008. IEEE Asia Pacific Conference on
  • Conference_Location
    Macao
  • Print_ISBN
    978-1-4244-2341-5
  • Electronic_ISBN
    978-1-4244-2342-2
  • Type

    conf

  • DOI
    10.1109/APCCAS.2008.4746360
  • Filename
    4746360