DocumentCode :
2331402
Title :
Preface - Welcome to the 10th International Meeting for Future of Electron Devices, Kansai
Author :
Akasaka, Y. ; Omura, Y.
Author_Institution :
Osaka University, Osaka, Japan
fYear :
2012
fDate :
9-11 May 2012
Firstpage :
1
Lastpage :
1
Abstract :
The International Meeting for Future of Electron Devices, Kansai (IMFEDK) was established in 2003 to provide an international opportunity for technical discussion in Kansai, Japan. Multidisciplinary discussions by various researchers and engineers from different point of views are much expected in the meeting for creating embryos of science and/or technology to be the main stream of device technology in future. That is why the meeting is set to cover all areas of electron devices in both theories and experiments ranging from fundamentals to feasibility studies including applications. This year, the 10th anniversary conference is cosponsored by IEEE EDS Kansai Chapter and IEEE SSCS Kansai Chapter. In the conference, 7 outstanding invited papers, 16 oral papers and 45 poster papers are included. We hope the conference to be the best and exciting place for young researchers to discuss, since they must be essential in the future activities on science and technologies. Conference theme of this year is "What\´s the 2nd Mainstream of Device Technology" ?? For Successive Evolution of Electron Devices-. In developed countries the aging society is becoming a serious problem and to look forward to creating a safe and comfortable life. To realize such a society effectively, semiconductor devices will become key components in various areas such as medical treatment, industry, social infrastructures, inspection and monitoring. Leading researchers in these fields are invited for the keynote speeches and the special session for the theme. It must be significant to review and discuss these technologies now on the IMFEDK for future welfare of the human being.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2012 IEEE International Meeting for
Conference_Location :
Suita, Japan
Print_ISBN :
978-1-4673-0837-3
Type :
conf
DOI :
10.1109/IMFEDK.2012.6218556
Filename :
6218556
Link To Document :
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