DocumentCode
2331891
Title
Multi-layer interconnect performance corners for variation-aware timing analysis
Author
Huebbers, Frank ; Dasdan, Ali ; Ismail, Yehea
Author_Institution
Northwestern Univ., Evanston
fYear
2007
fDate
4-8 Nov. 2007
Firstpage
713
Lastpage
718
Abstract
Parasitic interconnect corner methods are known to be inaccurate. This paper explains the sources of their errors and shows that errors in excess of 22% can occur in the predicted corner delays of a multi-layer stage in the presence of process variations. It is shown that exhaustive corner search methods are infeasible in practice as they have an exponential complexity in terms of required SPICE simulations with respect to the number of layers a stage is routed through. This exponential complexity is reduced to a linear one with a new simulation-based search method with the aid of stage delay properties. The ideas behind the simulation-based methodology are shown to be expandable to an analytical-based multi-layer performance comer location methodology. The simulated best/worst case delays based on these analytical corners produce errors below 4% as compared to the exhaustive search simulation based method.
Keywords
SPICE; integrated circuit interconnections; microprocessor chips; SPICE simulation; exponential complexity; microprocessor chip; multilayer interconnect performance corner method; variation-aware timing analysis; Analytical models; Delay; Dielectrics; Error analysis; Manufacturing processes; Performance analysis; SPICE; Search methods; Timing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4244-1381-2
Electronic_ISBN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2007.4397349
Filename
4397349
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