• DocumentCode
    2331891
  • Title

    Multi-layer interconnect performance corners for variation-aware timing analysis

  • Author

    Huebbers, Frank ; Dasdan, Ali ; Ismail, Yehea

  • Author_Institution
    Northwestern Univ., Evanston
  • fYear
    2007
  • fDate
    4-8 Nov. 2007
  • Firstpage
    713
  • Lastpage
    718
  • Abstract
    Parasitic interconnect corner methods are known to be inaccurate. This paper explains the sources of their errors and shows that errors in excess of 22% can occur in the predicted corner delays of a multi-layer stage in the presence of process variations. It is shown that exhaustive corner search methods are infeasible in practice as they have an exponential complexity in terms of required SPICE simulations with respect to the number of layers a stage is routed through. This exponential complexity is reduced to a linear one with a new simulation-based search method with the aid of stage delay properties. The ideas behind the simulation-based methodology are shown to be expandable to an analytical-based multi-layer performance comer location methodology. The simulated best/worst case delays based on these analytical corners produce errors below 4% as compared to the exhaustive search simulation based method.
  • Keywords
    SPICE; integrated circuit interconnections; microprocessor chips; SPICE simulation; exponential complexity; microprocessor chip; multilayer interconnect performance corner method; variation-aware timing analysis; Analytical models; Delay; Dielectrics; Error analysis; Manufacturing processes; Performance analysis; SPICE; Search methods; Timing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-1381-2
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2007.4397349
  • Filename
    4397349