• DocumentCode
    2332065
  • Title

    Performance and power evaluation of a 3D CMOS/nanomaterial reconfigurable architecture

  • Author

    Dong, Chen ; Chen, Deming ; Tanachutiwat, Sansiri ; Wang, Wei

  • Author_Institution
    Univ. of Illinois, Urbana-Champaign
  • fYear
    2007
  • fDate
    4-8 Nov. 2007
  • Firstpage
    758
  • Lastpage
    764
  • Abstract
    In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The proposed architecture is based on CMOS-nano hybrid techniques that incorporate nanomaterials such as carbon nanotube bundles and nanowire crossbars into CMOS fabrication process. Using unique features of FPGAs and a novel 3D stacking method enabled by the application of nanomaterials, 3D nFPGA obtains a 4.5X footprint reduction compared to traditional CMOS-based 2D FPGAs. With a customized design automation flow, we evaluate the performance and power of 3D nFPGA driven by the 20 largest MCNC benchmarks. Results demonstrate that 3D nFPGA is able to provide a performance gain of 2.6X with a small power overhead comparing to the CMOS 2D FPGA architecture.
  • Keywords
    CMOS integrated circuits; carbon nanotubes; field programmable gate arrays; nanoelectronics; nanowires; reconfigurable architectures; 3D nFPGA; CMOS 2D FPGA architecture; CMOS fabrication process; CMOS-nano hybrid techniques; CMOS/nanomaterial reconfigurable architecture; MCNC benchmarks; carbon nanotube bundles; customized design automation flow; nanoscale materials; nanowire crossbars; stacking method; CMOS technology; Carbon nanotubes; Copper; Field programmable gate arrays; Logic arrays; Nanoscale devices; Nanostructured materials; Reconfigurable architectures; Routing; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-1381-2
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2007.4397357
  • Filename
    4397357