• DocumentCode
    2332186
  • Title

    Photoluminescence study on recrystallization of ultra-shallow junction towards in-line measurements

  • Author

    Murai, Gota ; Okutani, Masashi ; Saikusa, Hiroki ; Yoshimoto, Masahiro ; Yoo, Woo Sik

  • Author_Institution
    Kyoto Inst. of Technol., Kyoto, Japan
  • fYear
    2012
  • fDate
    9-11 May 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Defect formation and annihilation in ultra-shallow junction (USJ) before and after rapid thermal annealing (RTA) are characterized by multiwavelength-excited photoluminescence (PL) technique with probing depths of excitation light in a range between 1.5 and 45 mm clearly identifies defects formed in the deep region beneath the shallow implanted layers. Compared with the results obtained by deep-level transient spectroscopy (DLTS), PL measurements at room temperature enable us to characterized defects of USJ layers with density in the density in the order of 1012 cm-3 or less, nondestructively on an in-line basis.
  • Keywords
    p-n junctions; photoluminescence; rapid thermal annealing; recrystallisation; spectroscopy; deep level transient spectroscopy; defect formation; in line measurements; photoluminescence study; probing depths; rapid thermal annealing; recrystallization; shallow implanted layers; temperature 293 K to 298 K; ultra shallow junction; wavelength 1.5 mm to 45 mm; Annealing; Junctions; Photoluminescence; Resistance; Silicon; Spectroscopy; Temperature measurement; deep-level transient spectroscopy; inline measurement; photoluminescence; rapid thermal annealing; recrystallization; ultra-shallow junction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, Kansai (IMFEDK), 2012 IEEE International Meeting for
  • Conference_Location
    Osaka
  • Print_ISBN
    978-1-4673-0837-3
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2012.6218592
  • Filename
    6218592