DocumentCode :
2332535
Title :
Effects of post annealing on IZO thin-film transistor characteristics
Author :
Morita, R. ; Maemoto, T. ; Sasa, S.
Author_Institution :
Nanomater. Microdevices Res. Center, Osaka Inst. of Technol., Osaka, Japan
fYear :
2012
fDate :
9-11 May 2012
Firstpage :
1
Lastpage :
2
Abstract :
We studied how post-annealing process affects the transparent thin-film transistor (TFT) characteristics. Polycrystalline indium zinc oxide layer deposited by rf magnetron sputtering on an unheated glass substrate was used for the active channel layer. The post annealing was conducted for 30 minutes by varying ambient gases and temperature. At annealing temperature of 450°C, the threshold voltage was shifted from -12 V to 0 V. Also, transconductance (gm) was improved by one order of magnitude. Structural dependence was also examined for top-gate structures with or without gate electrode overlap with sauce electrode.
Keywords :
annealing; thin film transistors; active channel layer; annealing temperature; gate electrode overlap; polycrystalline indium zinc oxide layer; post annealing; rf magnetron sputtering; sauce electrode; structural dependence; temperature 450 C; thin film transistor characteristics; top-gate structures; transconductance; unheated glass substrate; Annealing; Electrodes; Logic gates; Sputtering; Thin film transistors; Threshold voltage; Transconductance; IZO; TFT; post annealing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2012 IEEE International Meeting for
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-0837-3
Type :
conf
DOI :
10.1109/IMFEDK.2012.6218610
Filename :
6218610
Link To Document :
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