Title :
Signal integrity simulation design of image processor PCB combined with electromagnetic compatibility analyses based on Altium Designer 6
Author :
Cheng, Y.Q. ; Zhu, M. ; Ge, W.
Author_Institution :
Changchun Inst. of Opt., Fine Mech. & Phys., Chinese Acad. of Sci., Changchun
Abstract :
With the coming of the high-speed digital system age, signal integrity (SI) and electromagnetic compatibility (EMC) should not be ignored any more. In this paper, based on basic theories of SI and EMC, the high-speed digital design method for PCB using the SI simulation tool of Altium Designer 6 and EMC analyses is introduced, and the impedance control, power integrity (PI) design and SI (reflections and crosstalk) design of a piece of image processor PCB are demonstrated in detail. The simulation results show that the impedance control is perfect, reasonable termination can improve the waveforms and control the reflections and crosstalk.
Keywords :
circuit simulation; electromagnetic compatibility; microprocessor chips; printed circuit design; Altium designer 6; Signal integrity simulation design; electromagnetic compatibility analyses; high-speed digital design method; image processor PCB; impedance control; power integrity design; Analytical models; Electromagnetic analysis; Electromagnetic compatibility; Image analysis; Impedance; Process design; Reflection; Signal analysis; Signal design; Signal processing; Altium Designer 6; electromagnetic compatibility (EMC); high-speed digital design; signal integrity (SI); simulation;
Conference_Titel :
Industrial Electronics and Applications, 2009. ICIEA 2009. 4th IEEE Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-2799-4
Electronic_ISBN :
978-1-4244-2800-7
DOI :
10.1109/ICIEA.2009.5138304
