• DocumentCode
    2333946
  • Title

    OPC and CORBA in manufacturing execution systems: a review

  • Author

    Blanco, Paulo Marcelo P A ; Poli, Marco A. ; Barretto, Marcos R Pereira

  • Author_Institution
    Dept. of Mechatronics Eng., Sao Paulo Univ., Brazil
  • Volume
    2
  • fYear
    2003
  • fDate
    16-19 Sept. 2003
  • Firstpage
    50
  • Abstract
    While MES (manufacturing execution systems) are becoming increasingly more popular in the factory environment, the intrinsic hardware heterogeneity of equipment suppliers has always been a problem to their easy and cost-effective implementation. New distributed objects technologies now exist, both open and proprietary, operating system-dependent and independent, that can be used to solve this heterogeneity related problem. This work is intended to review the technologies of MES and new distributed objects, making a comparison of specifications, standards and commercial MES products based on each one. First, this work shows a general overview of MES and the potential of distributed objects applied to them: i.e. new concepts as intelligent sensors and other. Then, the two leading distributed object technologies will be reviewed: OPC/DCOM and CORBA. Finally, an industry survey focusing on commercial MES products and the distributed objects technology used by each one will be shown.
  • Keywords
    distributed object management; factory automation; manufacturing systems; process control; CORBA; OLE for process control; OPC; distributed component object model; distributed objects technologies; equipment suppliers; factory environment; intelligent sensors; manufacturing execution systems; object linking and embedding; Business process re-engineering; Companies; Costs; Enterprise resource planning; Internet; Manufacturing industries; Mechatronics; Production facilities; Productivity; Resource management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Technologies and Factory Automation, 2003. Proceedings. ETFA '03. IEEE Conference
  • Print_ISBN
    0-7803-7937-3
  • Type

    conf

  • DOI
    10.1109/ETFA.2003.1248669
  • Filename
    1248669