DocumentCode
233420
Title
Beyond multi-core: A survey of architectural innovations on microprocessor
Author
Uy, Roger Luis
Author_Institution
Comput. Technol. Dept., De La Salle Univ., Manila, Philippines
fYear
2014
fDate
12-16 Nov. 2014
Firstpage
1
Lastpage
6
Abstract
As single-core processors are getting faster, the dual problems of heat dissipation and efficient use of Instruction Level Parallelism (ILP) has now become a major problems. Major chip developers such as Intel® have shifted to multi-core processor. Multi-core processor has a lower clock rate than single-core processors, but this is offset with architectural innovations. These innovations have also been incorporated to provide value-added performance to the multi-core processor. This research paper will survey the different architectural innovations introduced as of 2012, map these innovations with Intel processors and analyze the relationship of architecture trends to the development of processor.
Keywords
microprocessor chips; multiprocessing systems; ILP; Intel processors; architectural innovations; heat dissipation; instruction level parallelism; microprocessor; multicore processor; single-core processors; Clocks; Microarchitecture; Microprocessors; Multicore processing; Program processors; Technological innovation; Transistors; Architectural innovations; Intel microarchitecture; computer architecture; multi-core architecture;
fLanguage
English
Publisher
ieee
Conference_Titel
Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment and Management (HNICEM), 2014 International Conference on
Conference_Location
Palawan
Print_ISBN
978-1-4799-4021-9
Type
conf
DOI
10.1109/HNICEM.2014.7016212
Filename
7016212
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