DocumentCode
2334474
Title
Nanosensors for ubiquitous network
Author
Othman, Masuri
Author_Institution
MEMS/NEMS Cluster, MIMOS Berhad, Kuala Lumpur, Malaysia
fYear
2010
fDate
1-3 Dec. 2010
Firstpage
1
Lastpage
2
Abstract
In this paper MIMOS and the R&D work on the nanomaterials for sensing elements and of material functionalization will be pursued towards application of sensors. The facility for nanomaterial growth is already available together with other equipments for material characterization such as atomic force microscopy (AFM), scanning electron microscopy (SEM) and transmission electron microscopy (TEM) to determine surface morphology, grain size and structure; small angle X-ray scattering (SAXS) for particle size distribution; and Raman spectroscopy to characterize the stress in materials and chemical binding. In this presentation, some of the work in the realization of nanosensor materials and their characterization will be disclosed.The availability of a 0.35μm wafer fabrication facility in MIMOS also allows us to fabricate nanostructures using standard semiconductor technology for application in nano-electromechanical sensors. In MIMOS, we are able to fabricate polysilicon, silicon dioxide, silicon nitride and tungsten nanostructures with dimensions down to 10 nm on an 8" silicon wafer by spacer technology.
Keywords
MIS devices; X-ray scattering; atomic force microscopy; elemental semiconductors; grain size; nanofabrication; nanomechanics; nanoparticles; nanosensors; particle size; scanning electron microscopy; silicon; silicon compounds; stress analysis; surface morphology; transmission electron microscopy; tungsten; AFM; MIMOS; Raman spectroscopy; SAXS; SEM; Si; Si3N4; SiO2; TEM; W; atomic force microscopy; chemical binding; grain size; grain structure; nanoelectromechanical sensors; nanomaterial growth; nanosensors; particle size distribution; polysilicon nanostructure; scanning electron microscopy; silicon dioxide nanostructure; silicon nitride nanostructures; size 0.35 mum; small angle X-ray scattering; stress analysis; surface morphology; transmission electron microscopy; tungsten nanostructure;
fLanguage
English
Publisher
ieee
Conference_Titel
Enabling Science and Nanotechnology (ESciNano), 2010 International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-8853-7
Type
conf
DOI
10.1109/ESCINANO.2010.5701089
Filename
5701089
Link To Document