DocumentCode :
2334584
Title :
Reducing silicon usage during technology development-a variance analysis approach
Author :
Rao, Suraj ; Saxena, Sharad ; Mozumder, P.K. ; Vasanth, Karthik ; Davis, Joseph ; Burch, Richard
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1998
fDate :
35953
Firstpage :
54
Lastpage :
57
Abstract :
During the development of semiconductor process flows, various process and device design alternatives must be evaluated to allow identification of the best candidate flow. In a development fab, this comparison is made in the presence of inherent manufacturing variation together with the variation associated with changes such as aggressive lithographic scaling and adoption of new unit processes. In this environment of high process variability, it is difficult to identify the best performance recipe from a set of candidate recipes. The problem is further exacerbated by the need to minimize silicon usage to lower development costs. In this paper, we describe a method to enhance the ability to detect the impact of design alternatives on device performances. The method uses simple statistical concepts to first account for and then adjust for the various sources of variation. The approach has two advantages. First, it significantly reduces the amount of silicon required for recipe comparison. The method allows us to evaluate flows based on as little as half- or quarter-wafer allocation without compromising experimental resolution. Second, the approach decouples the problem of evaluating design alternatives for performance improvement from the problem of controlling the higher variation associated with new processes. Once a good candidate recipe has been identified with the proposed method, it may be transferred to a more expensive but tightly controlled fab for volume production
Keywords :
design engineering; elemental semiconductors; integrated circuit design; semiconductor process modelling; silicon; statistical analysis; development costs; development fab; device design; device performance; experimental resolution; inherent manufacturing variation; lithographic scaling variation; performance recipe; process design; process recipe comparison; process variability; process variation sources; semiconductor process flow development; silicon usage minimization; silicon wafer usage reduction; statistical concepts; technology development; variance analysis; volume production; wafer allocation; Analysis of variance; Current measurement; Electric variables measurement; Histograms; Implants; MOS devices; Measurement standards; Process control; Silicon; Size measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Statistical Metrology, 1998. 3rd International Workshop on
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-4338-7
Type :
conf
DOI :
10.1109/IWSTM.1998.729770
Filename :
729770
Link To Document :
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