DocumentCode :
2334646
Title :
Influence of aluminum content on the structure of high strength and non-alloyed steel wires used in electronic nanotechnology components
Author :
Rusanescu, C.O. ; Gigel, Paraschiv
Author_Institution :
Fac. of Biotechnical Syst. Eng., Polytech. Univ. of Bucharest, Bucharest, Romania
fYear :
2012
fDate :
18-20 July 2012
Firstpage :
787
Lastpage :
791
Abstract :
The first ingredient necessary to build molecular-scale circuits is wire. These wires must be very thin, long, strong mechanical and electrical conductance have a good. The work analyze the austenite grain increase tendency, during the heating of high - carbon steels, at 900°C and 1000°C, which represents the limits of austeniting range in order to be patenting. When the carbon content is between 0.65 - 0.80 %, manganese is limited at 0.6 %, appeared that the steel has a small tendency of increasing the grain sizes (in the 900 - 1000°C range), and the aluminum microalloing is no more needed. Producing of steel using heat treatment an aluminum deoxidizing lead to a high purity steel and a fine grain structure after patenting characterized by a high ductility.
Keywords :
aluminium; carbon steel; ductility; grain size; heat treatment; nanoelectronics; wires (electric); aluminum content; aluminum deoxidization; austenite grain; carbon content; carbon steel; ductility; electronic nanotechnology component; grain size; grain structure; heat treatment; heating; high strength steel wire; manganese; non-alloyed steel wire; purity steel; temperature 900 degC to 1000 degC; Aluminum; Carbon; Heating; Logic gates; Manganese; Steel; Wires; electron microscopy; electronic circuit; high strength wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications (ICIEA), 2012 7th IEEE Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-2118-2
Type :
conf
DOI :
10.1109/ICIEA.2012.6360831
Filename :
6360831
Link To Document :
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