• DocumentCode
    2334747
  • Title

    Characterization of a multipolar electron cyclotron resonance microwave plasma source

  • Author

    Hopwood, Jeffrey ; Wagner, Rene ; Reinhard ; Asmusen

  • Author_Institution
    Michigan State Univ., East Lansing, MI, USA
  • fYear
    1989
  • fDate
    0-0 1989
  • Firstpage
    108
  • Abstract
    Summary Form only given, as follows. A microwave-cavity plasma applicator with multicusp electron cyclotron resonance (ECR) used as an ion beam source and for oxidation and etching of semiconductor materials has been characterized over its range of operating conditions. Single and double Langmuir probe measurements of electron density, ion density, and electron energy distribution functions have been made in the downstream region and as a function of power (120-250 W) and pressure (0.5-15.5 mtorr) in argon and oxygen. In addition, Faraday cup measurements of ion energies and optical emission data have been made. The plasma applicator is a 17.8 cm-diameter, 2.45 GHz cylindrical resonator with one end terminated by a sliding short and the other end by an overdense disk-shaped plasma. Processing of materials or ion extraction occurs at the field-free lower face of the plasma disk. Ion densities are typically 10/sup 11/-10/sup 12/ cm/sup -3/ at this point and decrease exponentially with distance downstream from the discharge. The electron energy distribution functions are Maxwellian and below 3 mtorr more closely follow a Druyvesteyn distribution with average energies of 5-8.5 eV. Ion energies to a grounded substrate are typically 10-25 eV with few, if any high-energy (>25 eV) ions.<>
  • Keywords
    electron density; ion sources; oxidation; plasma density; plasma devices; plasma diagnostics; plasma production; semiconductor technology; sputter etching; 0.5 to 15.5*10/sup -3/ torr; 120 to 250 W; 17.8 cm; 2.45 GHz; Ar plasma; Druyvesteyn distribution; Faraday cup measurements; Langmuir probe measurements; Maxwellian distribution; O plasma; electron density; electron energy distribution functions; ion beam source; ion density; ion energies; microwave-cavity plasma applicator; multipolar ECR microwave plasma source; optical emission; Charge carrier density; Ion sources; Oxidation; Plasma devices; Plasma generation; Plasma measurements; Plasma properties; Semiconductor device fabrication; Sputter etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1989. IEEE Conference Record - Abstracts., 1989 IEEE International Conference on
  • Conference_Location
    Buffalo, NY, USA
  • Type

    conf

  • DOI
    10.1109/PLASMA.1989.166148
  • Filename
    166148