DocumentCode
2336434
Title
Identification model-based control system design for semiconductor manufacturing equipment
Author
Hashimoto, Seiji ; Nitta, Mayumi ; Shimosakai, Keisuke ; Konuma, Miho
Author_Institution
Dept. of Electron. Eng., Gunma Univ., Kiryu, Japan
fYear
2009
fDate
25-27 May 2009
Firstpage
1735
Lastpage
1740
Abstract
In high-speed and high-precision control of a precision stage for semiconductor manufacturing, vibration of the axially moving factors leads to operational problems and limits their utility in many applications. Reaction force and vibration controls are a key to improve the control performance. In the present paper, aiming at a systematic design of the both control systems, the 6-degree of freedom (6DOF) equipment is developed. A precision XY stage is mounted on an active vibration isolator. Two counter weights driven by linear actuators are placed eccentric from the center of gravity, i.e., two weights are not co-axial. With the developed equipment, at first, the multi-input and multi-output (MIMO) modeling based on the subspace method is experimentally investigated. Using the identified MIMO model, the reaction force and vibration control systems as well as the positioning system are systematically designed based on the bilateral control strategy. Finally, the effectiveness of the proposed model-based control approach for the integrated design of the precision stage system is verified by the vibration suppression control experiments.
Keywords
MIMO systems; position control; vibration isolation; MIMO model; active vibration isolator; control system design; position control; semiconductor manufacturing equipment; vibration control; Control system synthesis; Control systems; Counting circuits; Force control; Isolators; Lead compounds; MIMO; Semiconductor device manufacture; Vibration control; Virtual manufacturing; Identification; Position control; Vibration control;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications, 2009. ICIEA 2009. 4th IEEE Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-2799-4
Electronic_ISBN
978-1-4244-2800-7
Type
conf
DOI
10.1109/ICIEA.2009.5138494
Filename
5138494
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