Title :
Research for curing process of mica-containing epoxy resin-TOA system with dynamic dielectric spectroscopy
Author :
Ling, Chen ; Guiyun, Liu
Author_Institution :
Dept. of Chem. Eng., Zhejiang Inst. of Technol., Hangzhou, China
fDate :
29 Oct-2 Nov 1989
Abstract :
The curing process of the mica-containing epoxy resin-TOA (tung oil anhydride) system was measured with a dielectric spectrometer at increasing temperatures. The theoretical analysis of the results of this dielectric spectroscopy and their experimental verification are presented. By processing the data of the tan δ versus T graph, the functional relation between the characteristic values T b, Tm of the spectroscopy and the curing reaction dynamic parameters E, k, t is established. By choosing a suitable frequency, the peak time on the tan δ-T spectroscopy is made equal to the gel time. It is concluded that this dielectric analysis at increasing temperatures makes it not only possible to study the curing characteristics of the curing reaction system but also to monitor and control the production of the stator windings of motors
Keywords :
composite insulating materials; dielectric losses; filled polymers; materials preparation; mica; reaction kinetics; curing process; dielectric loss tangent; dynamic dielectric spectroscopy; gel time; gelation peak; mica containing epoxy resin tung oil anhydride; peak time; production; stator windings of motors; Control systems; Curing; Dielectric measurements; Electrochemical impedance spectroscopy; Frequency; Monitoring; Petroleum; Production systems; Stator windings; Temperature control;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1989. Annual Report., Conference on
Conference_Location :
Leesburg, VA
DOI :
10.1109/CEIDP.1989.69578