DocumentCode
2337864
Title
Preface
fYear
2011
fDate
27-29 Sept. 2011
Abstract
Presents the welcome message from the conference proceedings.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
Conference_Location
Paris
Print_ISBN
978-1-4577-0778-0
Type
conf
Filename
6081049
Link To Document