DocumentCode
2339040
Title
Flexible microassembly system based on hybrid manipulation scheme
Author
Kim, Byungkyu ; Kang, Hyunjae ; Kim, Deok-Ho ; Park, Gwi Tae ; Park, Jong-Oh
Author_Institution
Microsystem Res. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea
Volume
2
fYear
2003
fDate
27-31 Oct. 2003
Firstpage
2061
Abstract
In this paper, a flexible microassembly system based on hybrid manipulation scheme is proposed and applied to the assembly of a photonic component. In order to achieve both high precision and dexterity in microassembly, we propose a hybrid microassembly system with sensory feedbacks of vision and force. This system consists of the distributed 6-DOF micromanipulation units, the stereo microscope, and haptic interface for the force feedback-based microassembly. A hybrid assembly method, which combines the vision-based microassembly and the scaled teleoperated microassembly with force feedback, is proposed. The feasibility of the proposed method is investigated via experimental studies for assembly micro opto-electrical components. Experimental results show that the hybrid microassembly system is feasible for applications to the assembly of photonic components in the commercial market with better flexibility and efficiency.
Keywords
computer vision; flexible manufacturing systems; force feedback; haptic interfaces; microassembling; micromanipulators; telecontrol; assembly micro optoelectrical components; degrees-of-freedom; distributed 6-DOF micromanipulation units; flexible microassembly system; force feedback-based microassembly; haptic interface; hybrid manipulation scheme; hybrid microassembly system; photonic component; scaled teleoperated microassembly; sensory feedbacks; stereo microscope; vision-based microassembly; Assembly systems; Automatic control; Automation; Force feedback; Laser excitation; Microassembly; Micromechanical devices; Optical fibers; Pump lasers; Robotic assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Robots and Systems, 2003. (IROS 2003). Proceedings. 2003 IEEE/RSJ International Conference on
Print_ISBN
0-7803-7860-1
Type
conf
DOI
10.1109/IROS.2003.1248973
Filename
1248973
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