• DocumentCode
    2339423
  • Title

    Characterization and testing of microelectromechnical accelerometers

  • Author

    Dasnurkar, Sachin ; Abraham, Jacob

  • Author_Institution
    Comput. Eng. Res. Center, Univ. of Texas at Austin, Austin, TX
  • fYear
    2008
  • fDate
    18-20 June 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Analog and Mixed Signal circuits pose a greater challenge in semiconductor testing than digital circuits due to the complexity of test requirements and the extremely large test vector sample space [?]. MicroElectroMechanical Systems (MEMS) are an emerging field combining mechanical components with semiconductor circuitry on-chip. Conventional testing and characterization methods for MEMS are very resource intensive. Alternate Testing, or Indirect Testing is a methodology used to identify and implement economical, fast and less complex tests to replace conventional complex, specification based tests [?]. This paper describes a methodology to characterize and test the mechanical subsystem of an accelerometer using its electrical sub-system. We use a novel pseudo-mechanical impetus to obtain an analog output which is then used for parameter mapping to characterize both electrical and mechanical subsystems in a purely electrical test. Measurements on commercial accelerometers demonstrate that the results of electrical tests correlates well with those from mechanical tests, providing an accurate low-cost solution for high-volume manufacturing test of accelerometers.
  • Keywords
    accelerometers; micromechanical devices; semiconductor device testing; electrical subsystem; electrical test; high-volume manufacturing test; microelectromechnical accelerometers; pseudomechanical impetus; Accelerometers; Circuit testing; Digital circuits; Electric variables measurement; Manufacturing; Mechanical variables measurement; Microelectromechanical systems; Micromechanical devices; Semiconductor device testing; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed-Signals, Sensors, and Systems Test Workshop, 2008. IMS3TW 2008. IEEE 14th International
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-2395-8
  • Electronic_ISBN
    978-1-4244-2396-5
  • Type

    conf

  • DOI
    10.1109/IMS3TW.2008.4581609
  • Filename
    4581609