Spectroscopic thin film thickness measurement system for semiconductor industries

Author

Horie, Masaki ; Fujiwara, Nariaki ; Kokubo, Masahiko ; Kondo, Noriyuki

Author_Institution

Dainippon SCREEN Manuf. Co. Ltd., Kyoto, Japan

fYear

1994

fDate

10-12 May 1994

Firstpage

677

Abstract

Accurate film thickness controls are indispensable for manufacturing defect-free semiconductor devices. Moreover, recent high integration requires simultaneous measurement of each film thickness and optical constants in multi-layers. This paper explains a microspectroscopic film thickness measurement system that measures film thickness at a very small spot (several micrometers in diameter) in several angstrom increments. This system also enables you to measure film thickness on bulk wafers and SOI wafers, and determine optical constants of unknown films

Keywords

optical constants; optical variables measurement; production testing; semiconductor device testing; spectroscopy; thickness measurement; SOI wafers; bulk wafers; defect-free semiconductor devices; manufacturing; microspectroscopic measurement; multi-layers; optical constants; semiconductor industries; simultaneous measurement; spectroscopic thin film thickness measurement; Integrated optics; Optical films; Semiconductor device manufacture; Semiconductor devices; Semiconductor films; Semiconductor thin films; Spectroscopy; Thickness control; Thickness measurement; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 1994. IMTC/94. Conference Proceedings. 10th Anniversary. Advanced Technologies in I & M., 1994 IEEE

Conference_Location

Hamamatsu

Print_ISBN

0-7803-1880-3

Type

conf

DOI

10.1109/IMTC.1994.352008

Filename

352008