Mechanical and fluidic characterization of microfluidic interconnects for lab-on-a-chip applications

In this paper, we present mechanical and fluidic testing apparatus and protocols that we have developed for characterizing both chip-to-chip and world-to-chip interconnects. We address the design, calibration, and limits of our testing apparatus. We also present standardized figures of merit that we have developed for comparing our interconnect structures and techniques. Finally, we address reliability issues when multiple interconnects between chips are involved.